LI Wen-ding, ZHANG Yang, LIU Yi-zhong, et al. Thermal and Bonding Characterizations of Soy Protein Adhesive[J]. China Wood Industry, 2015,29(2):9-12. DOI: 10.19455/j.mcgy.2015.02.002.
Derived from a renewable,biodegradable and environmentally friendly resource,soy protein adhesive(SPA)has been widely considered for a long time.The objective of the study was to evaluate thermal and bonding characteristics of SPA used in plywood manufacturing.At a heating rate of 20 ℃/min,the SPA samples totally cured at 157 ℃ and thermal degradation began at173 ℃.Testing results showed there was a positive linear correlation between glue consumption and bonding strength of the SPA bonded plywood samples.When the SPA plywood samples were made with 450g/m2 glue consumption(two sides)under 1.6 MPa pressure at 160 ℃ for 80s/mm,the wet bonding strength of the samples reached 0.78 MPa,which met the specification requirement of the National Standard GB/T 9846.3-2004 for typeⅡplywood.
关键词
大豆蛋白胶热反应特性胶合特性胶合板
Keywords
soy protein adhesive(SPA)thermal characteristicsbonding characteristicsplywood