XIE Lisheng1, ZHAO Renjie2, ZHANG Qisheng1. The Influence of Adhesive on Heat-conduction during Fiberboard Hot-pressing[J]. China Wood Industry, 2003,(2):15-16.
XIE Lisheng1, ZHAO Renjie2, ZHANG Qisheng1. The Influence of Adhesive on Heat-conduction during Fiberboard Hot-pressing[J]. China Wood Industry, 2003,(2):15-16. DOI: 10.19455/j.mcgy.2003.02.005.
Three types of fiberboard were made to study the influence of adhesive on heat conduction during the hotpressing cycle. The resin systems studied were PF, UF and a binderless system. Temperature recordings were made at the core of the fiberboard mat during hotpressing. Software was used to analyse the temperaturetime curves formed by the data, but there was little difference between the three curves. From the results, the authors concluded: 1) the effect of adhesive type on heatconduction through fiberboard mat during hotpressing is negligible and 2) the heatconduction property of bindeless dryprocessed fiberboard is also suitable for common dryprocessed fiberboard.