摘要:The paper described the reaction mechanism of selfbonding in dry process binderless fiberboard manufacture by infrared spectroscopy.The results showed that:1.During defibering,cellulose,hemicellulose and lignin were partly degraded.2.These degraded substances could be copolymerized during hot pressing.3.The increased hydroxyl after defibrinating partly formed hydrogen bonding during hot pressing, resulting in strengthened fiber self bonding.4.After hot pressing,there was an increase in hydrophobic carbonyl and a decrease in hydrophilic hydroxyl, which could help to explain the good waterproof ability of the board.
关键词:Dry process binderless fiberboard;Bonding mechanism;Infra red spectroscopy
摘要:In this paper, it was determined that the technological process of OSB overlaid with resin impregnated paper. The main technological parameters were obtained with the compound optimization method.As a result, the optimal manufacturing technology was as following:resin spread content 170 g/m 2,hot pressing time 9 min, hot pressing temperature 158 ℃,hot pressing pressure 1.85 MPa. And the testifying experiment showed that the optimal technological parameters were both practical and reliable.
关键词:OSB;OSB overlaid with resin impregnated paper;Optimization of technological parameters
摘要:This Paper introduced two practical techniques about wood treatment, one for wood protection from sapstains caused by blue fungi,the other for removal of blue stains from fungi attacked timber.Experimental analysis and results of production appilcation demonstrated that the wood treatment techniques had advantages of high efficiency,economy and safety,and so they are applicable to production practice.
关键词:Wood treatment;Protection against blue stains;Removal of blue stains
摘要:Drying quality of particle is mainly measured by deviation of end moisture content, uniformity and dried particle breakage. This article addressed the key moisture contents that directly determine drying quality in particle drying process, their functions and defining basis.