Studies on Bonding Mechanism of Dry process Binderless Fiberboard Part Ⅱ.FTIR Study of Binderless Fiberboard
- Issue 5, (1996)
DOI: 10.19455/j.mcgy.1996.05.001
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1. Research Institute of Wood Industry
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[1]曹忠荣,阎昊鹏,郭文莉.干法无胶纤维板粘合机理的研究Ⅱ.干法无胶纤维板的红外光谱分析[J].木材工业,1996(05):3-6.
Cao Zhongrong Yan Haopeng Guo Wenli. Studies on Bonding Mechanism of Dry process Binderless Fiberboard Part Ⅱ.FTIR Study of Binderless Fiberboard. [J]. China Wood Industry (5).(1996)
运用红外光谱分析法研究了干法无胶纤维板制造过程中木材组成成分官能团的变化,进而探讨了干法无胶纤维板的粘合机理。结果表明:(1)在热磨过程中,热磨制浆使木材中高聚物——纤维素、半纤维素、木素都有不同程度的降解。(2)在热压制板过程中,热磨降解后的木材成分经热压工艺能发生聚合反应,使木质纤维粘合成板。(3)热磨过程产生的活性羟基,热压后可以缔合形成氢键,增加了纤维之间的结合力,有利于木质纤维粘合成板。(4)热压成板后,憎水性羰基官能团增加,亲水性“自由的”羟基数量减少,增强了板的耐水性能
The paper described the reaction mechanism of selfbonding in dry process binderless fiberboard manufacture by infrared spectroscopy.The results showed that:1.During defibering,cellulose,hemicellulose and lignin were partly degraded.2.These degraded substances could be copolymerized during hot pressing.3.The increased hydroxyl after defibrinating partly formed hydrogen bonding during hot pressing, resulting in strengthened fiber self bonding.4.After hot pressing,there was an increase in hydrophobic carbonyl and a decrease in hydrophilic hydroxyl, which could help to explain the good waterproof ability of the board.
干法无胶纤维板粘合机理红外光谱
Dry process binderless fiberboardBonding mechanismInfra red spectroscopy
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