A soybean adhesive modified with polyamide（MPA） was developed to make P7 type particleboard. In the same time, liquefied soybean protein, defatted soybean flour and curing agent were all added to improve adhesive spreading and hot-pressing efficiency. The optimal manufacturing parameters were as follows: MPA solution : soybean flour : curing agent = 100 : 28 : 4,6,. The manufacturing parameters with 185 ℃ hot pressing for 250 s were successfully applied in a particleboard production line. Testing results of the 15.5 mm thick particleboards under 2 h water boiling showed that the properties of the particleboard could meet the specifications of P7 type according to Standard GB/T 4897-2015.