LIANG Yan-jun, YU Wen-ji. Application of Wood/Bamboo-Based Composites for Electromechanical Product Packaging. [J]. China Wood Industry 29(2):30-33(2015)
LIANG Yan-jun, YU Wen-ji. Application of Wood/Bamboo-Based Composites for Electromechanical Product Packaging. [J]. China Wood Industry 29(2):30-33(2015) DOI: 10.19455/j.mcgy.2015.02.007.
Application of Wood/Bamboo-Based Composites for Electromechanical Product Packaging
Solid wood is used as the main material for electromechanical product packaging,resulting in not only concerns for wood supply shortage and high cost issues,but also has a great potential for new packaging materials like wood/bamboo-based composites.The authors analyze structure types and loading requirements for electromechanical product packaging,and then discuss the advantages of wood/bamboo-based composites for electro-mechanical products packaging.And finally,they introduce the development trend of the new wood/bamboo scrimber material for electromechanical products packaging.
Research Institute of Wood Industry,Chinese Academy of Forestry
International Centre for Bamboo and Rattan
Shandong Jingbo Wood-based Material Co. Ltd.
Shandong Academy of Forestry
Key Laboratory of National Forestry and Grassland Administration for Silviculture of the Lower Yellow River,College of Forestry,Shandong Agricultural University,Taian