A dielectric method for monitoring adhesive curing behavior during the wood-based panel hot pressing process was developed by the authors.The principle of this technique was based on the change of dielectric loss during adhesive solidification.The dielectric loss factor was calculated by a dielectric constant which could be measured by embedded capacitor sensors and the dielectric loss angular tangent value.A field study verified that the in situ monitoring results could provide prompt feedback for optimizing adhesive formulation and the wood-based panel hot-pressing process.