Review | Views : 0 下载量: 188 CSCD: 5

  • Export

  • Share

  • Collection

  • Album

    • Review on Resin Development for Bonding Wood with High Moisture

    • 1. ENSTIB-LERMAB,University of Nancy 1, Epinal

      2. College of Wood Science and Technology Nanjing Forestry University

    • Vol. 23, Issue 5, Pages: 31-33(2009)   

    • DOI： 10.19455/j.mcgy.2009.05.009     

    扫 描 看 全 文

  • NA Bin1, LU Xiao-ning1, A.PIZZI2. Review on Resin Development for Bonding Wood with High Moisture. [J]. China Wood Industry 23(5):31-33(2009) DOI： 10.19455/j.mcgy.2009.05.009.
Alert me when the article has been cited
提交

相关文章

相关作者

暂无数据

相关机构

South Architectural Design Institute Co.,Ltd.
School of Civil and Hydraulic Engineering,Huazhong University of Science and Technology
中国林科院木材工业研究所
Research Institute of Wood Industry,Chinese Academy of Forestry,Key Lab of Wood Science and Technology of State Forestry Administration
Key Laboratory of Wood Science and Technology of State Forestry Administration
0