A series of experiments on determination of manufacturing technology for bamboo-based waferboard bonded with powdered phenol-formaldehyde （PF） resin were conducted by the authors. The optimum parameters obtained though the experiments were as follows: mat compression ratio at 1∶1.4 （board density 0.86 g/cm,3, ）, glue consumption of 3.5%, wafer moisture content 12% after resin application, and hot pressing at （165±5）℃ and 8.75 MPa, with closing speed at 12.5 mm/s, and pressing time at 1.35～1.45 min/mm. Waferboard made under the above conditions have excellent properties equal or even superior to the requirements of Canadian Standard CAN 3—O437.0—M85.