Three types of fiberboard were made to study the influence of adhesive on heat conduction during the hotpressing cycle. The resin systems studied were PF, UF and a binderless system. Temperature recordings were made at the core of the fiberboard mat during hotpressing. Software was used to analyse the temperaturetime curves formed by the data, but there was little difference between the three curves. From the results, the authors concluded: 1) the effect of adhesive type on heatconduction through fiberboard mat during hotpressing is negligible and 2) the heatconduction property of bindeless dryprocessed fiberboard is also suitable for common dryprocessed fiberboard.