LIN Qiao jia, HE Xiu shan, WU Chun chu, et al. Manufacturing of Nonpoisonous Low density Chinese Fir Particleboard Bonded with Diisocyanate Adhesive. [J]. China Wood Industry (3):27-30(2000)
LIN Qiao jia, HE Xiu shan, WU Chun chu, et al. Manufacturing of Nonpoisonous Low density Chinese Fir Particleboard Bonded with Diisocyanate Adhesive. [J]. China Wood Industry (3):27-30(2000) DOI: 10.19455/j.mcgy.2000.03.009.
Manufacturing of Nonpoisonous Low density Chinese Fir Particleboard Bonded with Diisocyanate Adhesive
This paper studies the technology for making nonpoisonous low density Chinese Fir ( Cunninghamia lanceolata) particleboard with diisocyanate adhesive. The effects of adhesive consumption, hot pressing temperature,time and pressure of hot pressing, moisture content of particles on properties of board were discussed. The result showed,when the density of board was 0.43~0.48 g/cm 3, the adhesive consumption was only 5%. Particles with moisture content lower than 25% were suitable for use. The manufactured particleboard was nonpoisonous with good water resistance.