ZHOU Zhao1, CAO Jian-chun1, TANG Pei-zhao1, et al. Particleboard Overlaid w ith Alum inium Foil. [J]. China Wood Industry (1):32-34(2000) DOI: 10.19455/j.mcgy.2000.01.011.
In this paper, the relationship betw een technological param eters (such as adhesive consum ption, pressing tem perature and pressing tim e) ofparticleboard overlaid w ith alum inum foil and the properties ofcom posite panelw ere discussed. The resultsshow ed thatthe m echanicalprop- erties especially the MOR of the com posite panelw ere increased obviously glued w ith epoxy resins w ith adhesive consum ption 490~630 g/m 2, pressing tem perature 80 ℃, pressure 0.2 MPa and pressing tim e 5 m in. This kind ofpanelare good to be used as packing,decorating and fitting m ate- rial.