Preparation and Performance of Lightweight High-Strength Particleboard Based with Epoxidized Soybean Oil -Modified Polyurethane Adhesive
- Pages: 1-10(2026)
DOI: 10.12326/j.2096-9694.2025144
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Institute of Wood Industry, Chinese Academy of Forestry, Beijing, 100091, China
Received:22 December 2025,
Revised:2026-04-10,
Accepted:13 April 2026,
Online First:13 April 2026,
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随着刨花板产业发展,刨花板的主要应用领域已突破传统家具板材的单一范畴,逐步拓展至墙板、大幅面台面板、高门板等新兴领域,这些新的应用场景对刨花板提出低密度、高强度的性能要求。针对三层刨花板芯层与表层的结构差异,提出环氧大豆油-异氰酸酯的协同双层聚氨酯胶黏剂改性策略,对照组芯层、表层均以异氰酸酯(polymeric methylene diphenyl diisocyanate,pMDI)为胶黏剂,改性组表层采用高强度环氧大豆油改性聚氨酯胶黏剂(Epoxy soybean oil modified polyurethane adhesive,EPA)、芯层采用轻量化发泡聚氨酯胶黏剂(Foamable polyurethane,FPU),以不同形态的杨木(
Populus alba
L
.
)刨花为原料制备密度为0.50、0.55、0.60 g/cm
3
的三层刨花板。通过测试静曲强度(Modulus of Rupture,MOR)、弹性模量(Modulus of Elasticity,MOE)、内结合强度(internal bond strength,IB)以及24 h吸水厚度膨胀率和吸水率,并结合扫描电子显微镜观察微观形貌与胶黏剂分布,探究胶黏剂对板材性能的调控机制。结果表明,三种低密度条件下,改性组均实现了轻量化与高性能的协同提升。其中,0.55 g/cm
3
的改性组(10%施胶量、190℃梯度热压)MOR、MOE、IB分别为12.3 MPa、1710 MPa、0.54 MPa,达到国家标准GB/T 4897—2015《刨花板》P2型板材的要求。微观形貌表征结果显示,改性组芯层形成三维多孔交联网络,是板材兼具低密度与高强度的关键。通过协同双层pMDI胶黏剂改性不仅降低pMDI消耗,而且优化板材的综合性能,为制备轻质高强刨花板提供了技术路径。
With the continuous development of the particleboard industry
its major applications have expanded beyond traditional furniture panels to emerging fields such as wall panels
large-format countertops
and tall door panels. These new application scenarios impose higher requirements for low-density yet high-strength particleboard. To address the distinct structural characteristics of the surface and core layers in three-layer particleboard
a synergistic double-layer polyurethane adhesive modification strategy based on epoxidized soybean oil and isocyanate was proposed. In the control group
both the surface and core layers were bonded with polymeric methylene diphenyl diisocyanate (pMDI). In the modified group
the surface layer was bonded with a high-strength epoxidized soybean oil-modified polyurethane adhesive (EPA)
while the core layer was bonded with a lightweight foamable polyurethane adhesive (FPU). Three-layer particleboards with target densities of 0.50
0.55
and 0.60 g/cm³ were manufactured from poplar (
Populus
sp.) particles of different geometries. The mechanical properties
including modulus of rupture (MOR)
modulus of elasticity (MOE)
and internal bond strength (IB)
as well as the 24 h thickness swelling and water absorption
were evaluated. In addition
scanning electron microscopy (SEM) was used to examine the microstructure and adhesive distribution in the panels
so as to elucidate the mechanisms by which the adhesives regulated panel performance. The results showed that
at all three low-density levels
the modified boards achieved a synergistic improvement in both weight reduction and performance. In particular
the modified board with a density of 0.55 g/cm³ (10% adhesive content and gradient hot pressing at 190 °C) exhibited MOR
MOE
and IB values of 12.3 MPa
1710 MPa
and 0.54 MPa
respectively
meeting the requirements for Type P2 particleboard specified in the Chinese national standard GB/T 4897—2015
Particleboard. Microscopic observations revealed that a three-dimensional porous cross-linked network was formed in the core layer of the modified board
which was the key to achieving both low density and high strength. Overall
the synergistic double-layer pMDI-based adhesive modification strategy not only reduced pMDI consumption
but also improved the overall performance of the boards
thereby providing a feasible technical route for the manufacture of lightweight high-strength particleboard.
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