胶合板用低甲醛释放脲醛树脂胶的增强改性

施晓宏; 唐雨枫; 沈云芳; 戴雪枫; 赵建忠; 桂成胜; 顾水祥

doi:10.12326/j.2096-9694.2020052

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胶合板用低甲醛释放脲醛树脂胶的增强改性
Preliminary Study on Improvement of Bond Strength of Low-Formaldehyde-Emission Urea-Formaldehyde Resin for Plywood
1.浙江升华云峰新材股份有限公司，浙江德清 313220
2021年35卷第2期页码：59-62
DOI： 10.12326/j.2096-9694.2020052

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施晓宏,唐雨枫,沈云芳等.胶合板用低甲醛释放脲醛树脂胶的增强改性[J].木材科学与技术,2021,35(02):59-62.

SHI Xiao-hong,TANG Yu-feng,SHEN Yun-fang,et al.Preliminary Study on Improvement of Bond Strength of Low-Formaldehyde-Emission Urea-Formaldehyde Resin for Plywood[J].Chinese Journal of Wood Science and Technology,2021,35(02):59-62.
施晓宏,唐雨枫,沈云芳等.胶合板用低甲醛释放脲醛树脂胶的增强改性[J].木材科学与技术,2021,35(02):59-62. DOI： 10.12326/j.2096-9694.2020052.

SHI Xiao-hong,TANG Yu-feng,SHEN Yun-fang,et al.Preliminary Study on Improvement of Bond Strength of Low-Formaldehyde-Emission Urea-Formaldehyde Resin for Plywood[J].Chinese Journal of Wood Science and Technology,2021,35(02):59-62. DOI： 10.12326/j.2096-9694.2020052.

摘要

采用水性环氧树脂溶液（WES）、脱酚46棉籽蛋白（DCP-46）加入到低甲醛释放脲醛树脂（LF-UF）胶中进行增强改性研究。通过试验优选的配比，交联剂WES和增强剂DCP-46添加量均为LF-UF用量的15%时，制备胶合板的II类胶合强度和III类胶合强度分别比对照组提高了145.7%、103.3%，均满足GB/T 9846—2015《普通胶合板》中杨木II类胶合强度、III类胶合强度限值（≥0.70 MPa）的要求，甲醛释放量（干燥器法）则基本保持不变，为0.2 mg/L，满足LY/T 2870—2017《绿色人造板及其制品技术要求》中甲醛释放量的限值（≤0.3 mg/L）要求。

Abstract

Waterborne epoxy resin solution (WES) and dephenol 46 cottonseed protein (DCP-46) were employed as reinforcing modifiers to improve the bond strength of low formaldehyde emission urea-formaldehyde resin (LF-UF). The results showed that when the dosage of WES and DCP-46 were at 15% of the LF-UF content, respectively, the bond strength of class II plywood and class III plywood were increased by 145.7% and 103.3%, which met the requirements of class II plywood and class III plywood of GB/T 9846—2015 ",Plywood for general use,". The formaldehyde emission remained unchanged, at 0.2 mg/L, which met the requirements of LY/T 2870—2017 ",Technical requirements of green wood-based panel and its products,".

关键词

胶合板水性环氧树脂低甲醛释放脲醛树脂棉籽蛋白胶合强度

Keywords

plywoodwaterborne epoxy resinlow-formaldehyde-emission urea-formaldehyde resincottonseed proteinbond strength

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