Since quality of wafer is one of the most critical factors to affect final quality of bamboo based waferboard, it is necessary to investigate main wafering factors affecting wafer quality, such as knife gap, cutting angle and cutting speed. Experimental testing results on bamboo species Dendrocalamus giganteus and Pleioblastus amarus with flatness and thickness deviation as quality indicators determined the best quality of the wafer, as well as the optimum wafering conditions through a series of single factor experiments and multi factor orthogonal experiments.