As reed’s SiO 2 content is high, it is difficult to glue with UF resin.4,4′ diphenylmethane diisocyanate(MDI) was used to manufacture reed particleboard in this study. The results showed that mechanical properties of the particleboard reached the requierment of high class and second class of A type particleboard standard of China GB/T 4879-92 when the resin consumption was 4% or 5% while the density of the particleboard was 0 70 g/cm 3. If the MDI price is reduced from RMB 20 yuan/kg to RMB 17 30yuan/kg,production costof the particleboard will be equal to that of particleboard bonded with urea formadehyde resin.