Development and Performance of Lightweight High-Strength Particleboards Made with Epoxidized Soybean Oil-Modified Polyurethane Adhesive

ZHANG Jie; LUO Shupin; GAO Li; GUO Wenjing

doi:10.12326/j.2096-9694.2025144

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Development and Performance of Lightweight High-Strength Particleboards Made with Epoxidized Soybean Oil-Modified Polyurethane Adhesive
Research Institute of Wood Industry，Chinese Academy of Forestry，Beijing 100091，China
Vol. 40, Issue 2, Pages: 32-41(2026)
DOI： 10.12326/j.2096-9694.2025144
稿件说明：

移动端阅览

张杰,罗书品,高黎等.基于环氧大豆油改性聚氨酯胶黏剂的轻质高强刨花板制备与性能研究[J].木材科学与技术,2026,40(02):32-41. DOI： 10.12326/j.2096-9694.2025144.

ZHANG Jie,LUO Shupin,GAO Li,et al.Development and Performance of Lightweight High-Strength Particleboards Made with Epoxidized Soybean Oil-Modified Polyurethane Adhesive[J].Chinese Journal of Wood Science and Technology,2026,40(02):32-41. DOI： 10.12326/j.2096-9694.2025144.

摘要

随着刨花板产业发展，刨花板主要应用领域已由传统家具板材逐步拓展至墙板、大幅面台面板、高门板等新兴领域，这些新的应用场景对刨花板提出低密度、高强度的性能要求。针对三层刨花板表层与芯层的结构差异，提出基于环氧大豆油的双层协同改性聚氨酯胶黏剂策略。以不同形态的杨木（

Populus

sp.）刨花为原料，制备密度分别为0.50、0.55、0.60 g/cm

的三层刨花板。对照组表层、芯层均以异氰酸酯（polymeric methylene diphenyl diisocyanate，pMDI）为胶黏剂，改性组表层采用高强度环氧大豆油改性聚氨酯胶黏剂（epoxy soybean oil modified polyurethane adhesive，EPA）、芯层采用轻量化发泡聚氨酯胶黏剂（foamable polyurethane，FPU）。通过测试刨花板的静曲强度（modulus of rupture，MOR）、弹性模量（modulus of elasticity，MOE）、内结合强度（internal bond strength，IB）以及24 h 吸水厚度膨胀率和吸水率，并结合扫描电子显微镜观察微观形貌与胶黏剂分布，探究胶黏剂对板材性能的调控机制。结果表明，在三种低密度条件下，改性组均实现轻量化与高性能的协同提升。其中，0.55 g/cm

改性组刨花板（施胶量10%、热压温度190 ℃）的MOR、MOE、IB 分别为12.33 MPa、1 710 MPa、0.54 MPa，达到国家标准GB/T 4897—2015《刨花板》P2型板材的要求。微观形貌表征结果显示，改性组芯层形成三维多孔交联网络，是板材兼具低密度与高强度的关键。通过双层协同改性聚氨酯胶黏剂不仅降低pMDI消耗，而且优化板材的综合性能，为制备轻质高强刨花板提供技术路径。

Abstract

With the continuous development of the particleboard industry

its major applications have expanded beyond traditional furniture panels to emerging markets such as wall panels

large-size countertops

and tall door boards. These new applications impose higher requirements for low-density yet high-strength particleboards. To address the structural characteristics of the surface and core layers in three-layer particleboard

a synergistic double-layer polyurethane adhesive modification strategy with epoxidized soybean o

il and isocyanate was proposed. Three-layer particleboards with target densities of 0.50

0.55

and 0.60 g/cm³ were manufactured from poplar (

Populus

sp.) particles of different geometries. In the control group

both the surface and core layers were bonded with polymeric methylene diphenyl diisocyanate (pMDI). In the development group

the surface layer was bonded with a high-strength epoxidized soybean oil-modified polyurethane adhesive (EPA)

while the core layer was bonded with a lightweight foamable polyurethane adhesive (FPU). The mechanical properties

including modulus of rupture (MOR)

modulus of elasticity (MOE)

and internal bond strength (IB)

as well as the 24 h thickness swelling and water absorption

were evaluated. In addition

scanning electron microscopy (SEM) was used to examine the microstructure and adhesive distribution in the panels

so as to elucidate the mechanisms by which the adhesives regulated panel performance. The results showed that

at all three low-density levels

the modified particleboards achieved a synergistic improvement in both weight reduction and performance enhancement. In particular

the modified particleboards with a density of 0.55 g/cm³ (10% adhesive content and gradient hot pressing at 190 °C) exhibited MOR

MOE

and IB values of 12.33 MPa

1 710 MPa

and 0.54 MPa

respectively

meeting the requirements for Type P2 particleboard specified in the Chinese national standard GB/T 4897—2015

Particleboard

. Microscopic observations revealed that a three-dimensional porous cross-linked network was formed in the core layer of the modified particleboards

which was the key to achieving both low density and high strength. Overall

the synergistic double-layer pMDI-based adhesive modification strategy not only reduced pMDI consumption

but also improved the overall performance of the particleboards

thereby providing a feasible technical route for manufacturing lightweight high-strength particleboards.

关键词

Keywords

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