有机-无机杂化改性大豆胶黏剂制备及其在三层结构刨花板中的应用

曾国栋; 崔辰; 朱峰; 董友明; 唐运表; 刘明; 李建章

doi:10.12326/j.2096-9694.2025111

“木质材料绿色制造”专栏 | 浏览量 : 0 下载量: CSCD: 0 CNKI被引量: 0 Crossref: 0 Wos: 0 Scopus: 0 更多指标

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有机-无机杂化改性大豆胶黏剂制备及其在三层结构刨花板中的应用
Preparation of Organic-Inorganic Hybrid Modified Soy-based Adhesive and its Application in Three-layer Particleboards
1.南京林业大学材料科学与工程学院，江苏南京 210037
2.广西丰林木业集团股份有限公司，广西南宁 530000
3.北京林业大学材料科学与技术学院，北京 100083
2025年39卷第5期页码：1-9
DOI： 10.12326/j.2096-9694.2025111
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曾国栋,崔辰,朱峰等.有机-无机杂化改性大豆胶黏剂制备及其在三层结构刨花板中的应用[J].木材科学与技术,2025,39(05):1-9. DOI： 10.12326/j.2096-9694.2025111.

ZENG Guodong,CUI Chen,ZHU Feng,et al.Preparation of Organic-Inorganic Hybrid Modified Soy-based Adhesive and its Application in Three-layer Particleboards[J].Chinese Journal of Wood Science and Technology,2025,39(05):1-9. DOI： 10.12326/j.2096-9694.2025111.

摘要

为了解决大豆胶黏剂耐水性差、易霉变，难以适应刨花板生产工艺的问题，通过二硫化钼纳米片与聚乙烯亚胺协同改性大豆胶黏剂，并将其应用于刨花板制备。结果表明，改性大豆胶黏剂的断面结构更加致密，耐水性提高，室温贮存20 d未发生霉变。制备的三层结构刨花板静曲强度（19.20 MPa）、弹性模量（2.77 GPa）、内胶合强度（0.73 MPa）、表面胶合强度（1.10 MPa）、2 h吸水厚度膨胀率（1.88%）等性能指标均满足GB/T 4897—2015《刨花板》关于P2型刨花板的要求，且防霉等级达到LY/T 2230—2013《人造板防霉性能评价》中1级要求。

Abstract

The application of soy-based adhesives is limited due to its poor water resistance

susceptibility to mildew

and incompatibility with particleboard manufacturing processes. To overcome these shortcomings

this study improved the adhesive’s performance by synergetic modification using MoS

and polyethyleneimine

and tested the physical-mechanical properties and mildew resistance of particleboard. Results showed that the modified soy-based adhesive exhibited a dense fracture structure

improved cohesive strength and water resistance

and excellent mildew resistance. The fabricated three-layer particleboard demonstrated excellent physical and mechanical properties

including a static flexural strength of 19.20 MPa

elastic modulus of 2.77 GPa

internal bonding strength of 0.73 MPa

surface bonding strength of 1.10 MPa

and a 2-h water absorption thickness expansion rate of 1.88%

which met the Type P2 requirements specified in GB/T 4897—2015

Particleboard

. Notably

the particleboard achieved a mildew resistance with an infection grading value exceeding level 1 according to LY/T 2230—2013 S

tandard method of evaluating the resistance of wood-based panels to mold

. These properties demonstrated a great potential of using the modified soy-based adhesive in manufacturing particleboards.

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references

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